The OSD32MP15x module is the first System in Package based on the STMicroelectronics STM32MP1. Delivering all the power of a full Microprocessor system in a package that feels like a Microcontroller, the OSD32MP15x has a footprint that is the same size as the ST32MP1 itself. The SiP integrates the STM32MP15x Dual Core Arm? Cortex? A7 and an Arm? Cortex? M4, up to 1GB DDR3, STPMIC1 Power Management IC, EEPROM, MEMS Oscillator, and passives into single BGA package.

At only 18mm x 18mm, the OSD32MP15x brings developers a footprint that is up to 64% smaller than an equivalent design with discrete components. Integrated into a BGA with all signals escaped into one layer, this system in package means faster designs and simplified supply chain.

STM32MP1 Highlights:
Along with the Dual Core Arm? Cortex? A7 and an Arm? Cortex? M4, the STM32MP15x microprocessor also incorporates a 3D GPU OpenGL ES2.0 Graphics processor, 2 x 22 channels of 16bit ADC and a host of connectivity including a camera interface. For control, the ST32MP15x provides 2x 16-bit PWM, up to 29 timers and 3 watchdogs. For the growing market of internet connected applications, it offers TrustZone?, TDES, AES-256 security features.

The Cortex M4 and peripherals in the STM32MP15x are compatible with ST’s stand alone M4 devices. Code ports seamlessly from existing M4 designs. The integration provided by the OSD32MP15x SiP makes the transition even easier, removing the hardware complexities associated with a processor design.

STPMIC1 Highlights:
The STPMIC1 within the OSD32MP15x SiP module is designed to pair with needs of ST32MP15x customers. It requires only a single input voltage for the processor and provides an integrated 5.2V Boost as well as a Buck, 4 LDOs and 2 power switches for use in the system.

OSD32MP15x Features

OSD335x System-in-Package

A New Era of Integration and Flexibility based on AM335x

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Faster and Smaller Designs, Simplified Supply Chain, Low Cost Manufacturing

The Octavo Systems OSD335x System-in-Package (SiP) device is the first device in the OSD335x Family. It integrates the Texas Instruments Sitara ARM? Cortex?-A8 AM335x Processor, DDR3 memory, TPS65217C PMIC, TL5209 LDO, and all needed passive components into a single 27mm X 27mm BGA package.

Integrating the DDR3, power system, and passive devices into the single package removes the complexities of DDR3 to processor interfacing and power sequencing. This allows for a vastly simplified final system design.

The 400 Ball BGA package is 40% smaller than the equivalent discrete design making it a great solution for space constrained applications. The package also utilizes a 1.27mm (50 mil) ball pitch making it extremely easy to assemble. The ball pitch also allows for the use of more relaxed Printed Circuit Board (PCB) design rules, saving PCB cost.

The OSD335x provides a quick and easy way to implement a system around the TI AM335x while also providing space savings, simplified supply chains, lower cost manufacturing, and greater reliability.

Additional Variants:
OSD335x-SM – Same functionality in a smaller package and adds EEPROM.
OSD335x C-SiP – Same functionality but adds eMMC Flash, MEMs Oscillator, and EEPROM.

OSD335x Features